Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB
Brief introduction
ShenZhen KAZ Circuit Co.,LTD, mainly focus on PCB and PCBA for more than 10 years, is engaged in high precision single-sided, double-sided, multilayer printed circuit board and metal substrate circuit board production with rich-experience production team and timely delivery, and has approved ISO9001, SGS, ROHS, USA UL and TS16949 certification in succession.
The Products in our company are custom-made based on the GERBER and BOM you provided.
What KAZ Circuit can do for you:
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Detailed specification
| Board material | FR-4 |
| Surface treatment | Immersion Gold/0.05-0.1um |
| Board thickness | 1.6mm |
| copper thickness | 1oz |
| silkscreen | White/Black |
| soldermask | Green/Blue/Black |
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Multilayer PCB
Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.
Advantages of multi-layer PCBs:
Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution
Composition of multi-layer PCBs:
Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between layers
Surface treatment: HASL, ENIG, OSP and other surface treatment processes
Design and manufacture of multi-layer PCBs:
Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and routing optimization
Process design: Aperture size, layer spacing, copper foil thickness, etc.
Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.
More photos
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